121. Measuring electrical interfacial resistance of metal using modified transfer length method
J. Park(†), S. Park(†), H. Kim, H. Yoo, D. Koo, W. Kim, H.S. Na, J. Kim, H.S. Park, and H. So* († equal contribution)
Measurement, 286, 122344 (2026) [PDF] (I.F.: 6.1, JCR Top 9.2%, Q1)
120. Decoupling PEG and Chloride co-adsorption kinetics at copper/electrolyte interface during pattern-dependent electrodeposition
S. Cho(†), J. Park(†), S. Park, Y. Seol, J. Shim, H.-S. Kim*, and H. So* († equal contribution)
Applied Surface Science, 746, 167516 (2026) [PDF] (I.F.: 6.9, JCR Top 4.7%, Q1)
119. Integrated electrochemical characterization and finite element modeling for optimizing copper filling in through-glass vias: Kinetic parameter extraction and profile prediction
Y.-W. Kim , J.-H. Baek, S.-M. Lee, J.-W. Park, H.-J. Lee, T.-H. Kim, J.-H. Shim, H. So*, and H.-S. Kim*
Journal of Electroanalytical Chemistry, 1017, 120313 (2026) [PDF] (I.F.: 4.1, JCR Top 20.9%, Q1)
118. Bridging passive and active cooling: A review of geometric design strategies for hybrid electronic packaging systems
M. Jung(†), H. Jang(†), and H. So* († equal contribution)
Applied Thermal Engineering, 302, 131766 (2026) [PDF] (I.F.: 6.9, JCR Top 4.7%, Q1)
117. A comprehensive review of machine learning approaches for predicting warpage and thermal resistance in advanced semiconductor packaging
J. Park(†), D. Kim(†), S. Yang, M. Kim, and H. So* († equal contribution)
JMST Advances, 8, 71-90 (2026) [PDF] (Invited Review)
116. Strategic selection of multi-parametric laser settings and clinical endpoints in dermatology: An engineering-to-clinical review
S. Park(†), J. Hyeon(†), and H. So* († equal contribution)
Lasers in Medical Science, 41, 137 (2026) [PDF] (I.F.: 2.4, JCR Top 25%, Q1)
115. Prediction of corrosion behavior of stainless steels with effective corrosion factors using a SHAP-based deep learning framework
J. Kim(†), S. Woo(†), S. Kim, J. Jeong, K. Baek, I. Kim, J. Ahn, S. Shin, and H. So* († equal contribution)
Journal of Materials Research and Technology, 41, 6570-6582 (2026) [PDF] (I.F.: 6.6, JCR Top 6.3%, Q1)
114. Wet-spun hybrid hydrogel fibers exhibiting high electrical and mechanical stability in flexible electronics
A. Sinha(†), J. Kim(†), S. Park, D. Koo, and H. So* († equal contribution)
Materials & Design, 262, 115432 (2026) [PDF] (I.F.: 7.9, JCR Top 19%, Q1)
113. Microstructured anisotropic PDMS sheet for damage-free electrical testing of semiconductor packages
Y. Seol, J. Jeong, J.-H. Shim, H.-S. Kim, and H. So*
Sensors & Actuators: A. Physical, 399, 117393 (2026) [PDF] (I.F.: 4.9, JCR Top 17.1%, Q1)
112. Programmable FPGA-based TDLAS-WMS Hygrometer (PFTWH) for broad-range water vapour detection: quantitative assessment of digital lock-in amplifier (DLIA) performance via integrated WMS system (I-WMS)
M. Choi(†), G. Cho(†), S. Hwang, Y. Kim, J. Kim, J. Lee, K. Kim, H. So*, and S. Choi* († equal contribution)
Sensors & Actuators: B. Chemical, 448, 138930 (2026) [PDF] (I.F.: 7.7, JCR Top 1.2%, Q1)
111. Rapid and precise geometric measurement of injection-molded axial fans using convolutional neural network regression
K. Baek(†), S. Shin(†), M. Kim, J. Oh, Y. B. Kim, M. D. Kim, and H. So* († equal contribution)
Advanced Intelligent Systems, 8, 2500364 (2026) [PDF] (I.F.: 6.1, JCR Top 13.5%, Q1)
[Selected in Hot Topic: Artificial Intelligence and Machine Learning]
110. Real-time monitoring of temperature distribution on silicon wafer using hybrid neural network-based regression model
J. Kim(†), S. Kim(†), J. Park, S. Seo, and H. So* († equal contribution)
International Communications in Heat and Mass Transfer, 169, 109862 (2025) [PDF] (I.F.: 6.4, JCR Top 3.6%, Q1)
109. Design of annular-shaped heater for measurement of anisotropic thermal conductivity using 3-ω method
D. Koo(†), J. Park(†), M. Jung, S. Park, H.S. Na, W. Kim, H.S. Park*, and H. So* († equal contribution)
Case Studies in Thermal Engineering, 74, 106888 (2025) [PDF] (I.F.: 6.4, JCR Top 7%, Q1)
108. Advanced optical integration processes for photonic-integrated circuit packaging: A review
K. Baek, M. Kim, H.-S. Kim*, J. Ahn*, and H. So*
Advanced Materials Technologies, 10, e01848 (2025) [PDF] (I.F.: 6.4, JCR Top 22.7%, Q1)
107. Ppy/PDMS sponge-based flexible pressure sensors with enhanced sensitivity and wide detection range using programmable gradient pore density
B. Chun(†), J. Park(†), J. Bang, J. Lim*, Y. Han, and H. So* († equal contribution)
ACS Applied Electronic Materials, 7, 6002-6014 (2025) [PDF] (I.F.: 4.4, JCR Top 22.8%, Q1)
106. Rapid prediction of local mean age of air for energy-efficient ventilation systems using permutation feature importance
S. Shin(†), K. Baek(†), and H. So* († equal contribution)
International Journal of Energy Research, 2025, 3878472 (2025) [PDF] (I.F.: 4.2, JCR Top 1.2%, Q1)
105. Hollow microneedles as a flexible dosing control solution for transdermal drug delivery
J. Kim(†), J. Jeong(†), J.K. Jo*, and H. So* (†equal contribution)
Materials Today Bio, 32, 101754 (2025) [PDF] (I.F.: 10.2, JCR Top 6.9%, Q1)
104. Gecko-inspired soft actuators for wafer handling via overcuring-induced anisotropic microstructures in DLP 3D printing
S. Kim(†), J. Kim(†), S. Seo, and H. So* († equal contribution)
Microsystems & Nanoengineering, 11, 68 (2025) [PDF] (I.F.: 9.9 JCR Top 0.6%, Q1)
103. Rapid thermal runaway detection of lithium-ion battery via swelling-based state-of-charge monitoring using piezoresistive sponge sensor
J. Bang, B. Chun, M. Kim, J. Lim*, Y. Han, and H. So*
eTransportation, 24, 100404 (2025) [PDF] (I.F.: 17.0 JCR Top 0.6%, Q1)
102. Microstructural analysis and design of electroplated-Cu micropillar under different process variables and pattern structures
S. Park(†), B. Chun(†), S. Kim, H.-S. Kim, and H. So* († equal contribution)
Materials & Design, 252, 113715 (2025) [PDF] (I.F.: 7.9, JCR Top 19%, Q1)
101. Chemical-responsive curved actuator using PDMS/Ecoflex composite bilayer for rapid detection of chemical solvent leakage
J. Sung(†), K. Baek(†), and H. So* († equal contribution)
Sensors and Actuators: B. Chemical, 429, 137284 (2025) [PDF] (I.F.: 8.0, JCR Top 0.7%, Q1)
100. Recent developments of in-situ process and in-line quality monitoring in injection molding using intelligent sensors
S. Shin(†), K. Baek(†), J. Oh, Y. B. Kim, M. D. Kim, and H. So* († equal contribution)
Sensors and Actuators: A. Physical, 383, 116248 (2025) [PDF] (I.F.: 4.9, JCR Top 17.1%, Q1)
99. Prediction of excess air ratio through deep neural network-based multidimensional analysis of OH* radical intensity and fuel pressure in flame
B. So(†), M. Kwon(†), J. Kim, S. Kim, and H. So* († equal contribution)
International Journal of Energy Research, 2025, 9934909 (2025) [PDF] (I.F.: 4.2, JCR Top 1.2%, Q1)
98. A novel strategy utilizing graphene oxide/functionalized carbon nanotube/nanosilica sheet for nanomaterial incorporation in cement paste
H. Suh(†), D. Koo(†), D.-H. Son, J. Park, S. Kim, B.-I. Bae, C.-S. Choi, H. So, and S. Bae* († equal contribution)
Cement and Concrete Composites, 157, 105918 (2025) [PDF] (I.F.: 13.1, JCR Top 0.5%, Q1)
97. Physiologically compatible MWCNT-incorporated PNCPG self-healed ionic breathable hydrogel for wearable smart strain sensor application
A. Sinha, D. Koo, J. Kim, H. So*
Nano Today, 61, 102606 (2025) [PDF] (I.F.: 13.2, JCR Top 7.6%, Q1)
96. IMPMH, direct tunable diode laser absorption spectroscopy for detection of water vapour under “Optically thick Condition”
S. Hwang, M. Choi, H. So, K. Kim, and Sun Choi*
Spectrochimica Acta Part A, 326, 125295 (2025) [PDF] (I.F.: 4.6, JCR Top 10.2%, Q1)
95. Negative temperature coefficient effect of TPU/SWCNT/PEDOT:PSS polymer matrices for wearable temperature sensors
Y. Choi(†), M. Kim(†), and H. So* († equal contribution)
Polymer Testing, 141, 108652 (2024) [PDF]
94. Effects of electrolyte flow direction on height difference in electroplated Cu microstructures for fine-pitch RDL
S. Park(†), D. Koo(†), Y. Choi, J. Park, and H. So* († equal contribution)
Journal of Materials Research and Technology, 33, 8887-8894 (2024) [PDF]
93. Impact of Static Electric Field on Dielectrophoretic Alignment of Silicon Nanowires
L. Hong, D. Koo, H. Shin, S. Choi, H. So, J. B. Park*, W. Park*, and J. Shin*
Advanced Materials Interfaces, 2024, 2400491 (2024) [PDF]
92. SWCNT/PEDOT:PSS/TPU electrothermal composites for flexible, wearable heater under low temperature environmental conditions
Y. Choi, B. Chun, and H. So*
Composites Communications, 52, 102138 (2024) [PDF]
91. Recent developments in preventing catheter-related infections based on biofilms: A comprehensive review
B. So, J. Kim, J.K. Jo, and H. So*
Biomicrofluidics, 18, 051506 (2024) [PDF]
90. Fabrication of functional surfaces using layer height method in material extrusion type 3D printing
J. Sung, Y. Choi, and H. So*
Journal of Materials Research and Technology, 33, 749-757 (2024) [PDF]
89. Continuous monitoring of water levels for industrial boilers using single-stage object recognition YOLO-v5
J. Kim (†), M. Kwon (†), B. So, S. Kim, and H. So* († equal contribution)
International Journal of Energy Research, 2024, 6107765 (2024) [PDF]
S. Shin, S. Park, and H. So*
International Journal of Energy Research, 2024, 1119181 (2024) [PDF]
A. Sinha and H. So*
Nanoscale Horizons, 9, 1855-1895 (2024) [PDF]
A. Sinha, J. Lee, J. Kim and H. So*
Materials Horizons, 11, 5181-5208 (2024) [PDF]
S. Park (†), M. Kim (†), and H. So* († equal contribution)
NPG Asia Materials, 16, 26 (2024) [PDF]
J. Sung, K. Baek, and H. So*
Sensors and Actuators: A. Physical, 369, 115172 (2024) [PDF]
S. Shin, K. Baek, Y. Choi, and H. So*
Advanced Intelligent Systems, 6, 2300711 (2024) [PDF]
J. Choe, H. Kwon, H. Kim, D. Koo, and H. So*
Scientific Reports, 14, 3976 (2024) [PDF]
J. Kim, B. So, Y. Heo, J.K. Jo* and H. So*
World Journal of Mens Health, 42, 667-680 (2024) [PDF]
J. Kim, B. So, Y. Heo, J.K. Jo* and H. So*
World Journal of Mens Health, 42, 487-501 (2024) [PDF]
M. Choi, S. Park, S. Choi* and H. So*
Sensors & Actuators: A. Physical, 363, 114754 (2023) [PDF]
S. Shin (†), M. Kwon (†), S. Kim, and H. So* († equal contribution)
International Journal of Energy Research, 2023, 3889951 (2023) [PDF]
J. Lee and H. So*
Macromolecular Rapid Communications, 44, 2300352 (2023) [PDF]
J. Bang (†), K. Baek (†), J. Lim*, Y. Han, and H. So* († equal contribution)
Advanced Intelligent Systems, 5, 2300186 (2023) [PDF]
[Selected as an Inside Front Cover Image]
J. Bang, B. Chun, J. Lim*, Y. Han, and H. So*
ACS Applied Materials & Interfaces, 15, 34120-34131 (2023) [PDF]
Y. Choi (†), K. Baek (†), and H. So* († equal contribution)
Scientific Reports, 13, 10691 (2023) [PDF]
D. Hwangbo, D-H. Son*, H, Suh, J. Sung, B-I. Bae, S. Bae, H. So, and C-S. Choi
Case Studies in Construction Materials, 18, e02206 (2023) [PDF]
D. Koo (†), J. Sung (†), H. Suh, S. Bae, and H. So* († equal contribution)
Composites Part A, 173, 107639 (2023) [PDF]
S. Shin (†), S. Park (†), A. Toor, and H. So* († equal contribution)
Cellulose, 30, 6119-6147 (2023) [PDF]
J. Sung and H. So*
Sensors & Actuators: B. Chemical, 387, 133834 (2023) [PDF]
K. Baek, S. Shin, and H. So*
Engineering Applications of Artificial Intelligence, 123, 106309 (2023) [PDF]
S. Shin, K. Baek, and H. So*
Building and Environment, 234, 110191 (2023) [PDF]
J. Kim(†), J. Lee(†), B. So, J.K. Jo*, and H. So* († equal contribution)
Sensors & Actuators: A. Physical, 354, 114267 (2023) [PDF]
J. Lee and H. So*
Microsystems & Nanoengineering, 9, 44 (2023) [PDF]
[HOT PAPER AWARD (2022-2024) from the 10th Anniversary of Microsystems & Nanoengineering]
S. Park, J. Bang, and H. So*
Surfaces and Interfaces, 37, 102678 (2023) [PDF]
S. Han, J. Sung, B. Ko, M. Kwon, S. Kim*, and H. So*
Bioinspiration & Biomimetics, 17, 046008 (2022) [PDF]
D. Koo and H. So*
Scientific Reports, 12, 6346 (2022) [PDF]
S. Shin, G. Park, W.-Y. Kim, and H. So*
IEEE Access, 10, 45073-45079 (2022) [PDF]
B. Ko, S. Shin, and H. So*
Express Polymer Letters, 7, 694-704 (2022) [PDF]
K. Baek, J. Bang, J. Lee, M. Choi, and H. So*
IEEE Access, 10, 31445-31454 (2022) [PDF]
J. Lee, J. Sung, J. K. Jo*, and H. So*
International Journal of Bioprinting, 8, 549 (2022) [PDF]
J. Sung, H. M. Lee, G. H. Yoon, S. Bae, and H. So*
Int. J. Precision Eng. Manufacturing-Green Technology, 10, 85-96 (2022) [PDF]
[Editor-in-Chief's Choice]
S. Park, J. Sung, and H. So*
Surfaces and Interfaces, 29, 101721 (2022) [PDF]
S. Shin, B. Ko, and H. So*
Microsystems & Nanoengineering, 8, 12 (2022) [PDF]
V. T. Tran, T. I. Mredha, Y. Lee, M. Todo, H. So, E. Jeong, W. Park, and I. Jeon*
Advanced Functional Materials, 2110177 (2022) [PDF]
E. Z. Nezhad*, M. Sarraf*, F. Musharavati, F. Jaber, J. Wang , H. Hosseini, S. Bae*, M. Chowdhury, H. So, and N. Sukiman
Surfaces and Interfaces, 28, 101623 (2022) [PDF]
S. Shin, B. Ko, and H. So*
International Journal of Heat and Mass Transfer, 183, 122236 (2022) [PDF]
S. Park(†), B. Ko(†), H. Lee, and H. So* († equal contributions)
Scientific Reports, 11, 12179 (2021) [PDF]
G. H. Yoon*, H. Choi, and H. So
J. Low Frequency Noise, Vibration and Active Control, 40, 880-897 (2021) [PDF]
H. M. Lee, J. Sung, B. Ko, H. Lee, S. Park, H. So, and G. H. Yoon*
J. Mechanical Behavior of Biomedical Materials, 118, 104412 (2021) [PDF]
G. H. Yoon* and H. So
Structural and Multidisciplinary Optimization, 63, 2355-2373 (2021) [PDF]
J. Sung, S. Park, and H. So*
IEEE Sensors Journal, 21, 16403-16408 (2021) [PDF]
[Selected as a Feature Article]
S. Shin(†), H. Lee(†), and H. So* († equal contributions)
IEEE Access, 9, 54184-54189 (2021) [PDF]
S. Shin and H. So*
Additive Manufacturing, 39, 101893 (2021) [PDF]
J. Sung and H. So*
Surfaces and Interfaces, 23, 100935 (2021) [PDF]
S. Han, J. Sung, and H. So*
Int. J. Precision Eng. Manufacturing-Green Technology, 8, 1449-1459 (2021) [PDF]
S. Shin and H. So*
Smart Materials and Structures, 29, 105016 (2020) [PDF]
J. Sung and H. So*
IEEE Sensors Journal, 20, 11007-11013 (2020) [PDF]
S. Shin, J. Sung and H. So*
Sensors & Actuators: A. Physical, 309, 112009 (2020) [PDF]
S. Shin and H. So*
IEEE Sensors Journal, 20, 4164-4170 (2020) [PDF]
S. Shin, B. Kang and H. So*
Sensors & Actuators: A. Physical, 303, 111783 (2020) [PDF]
B. Kang, J. Sung and H. So*
Int. J. Precision Eng. Manufacturing-Green Technology, 8, 47-55 (2020) [PDF]
B. Kang, J. Hyeon and H. So*
Applied Surface Science, 499, 143733 (2020) [PDF]
S. Shin, J. Sung, H. Jeon and H. So*
Int. Journal of Advanced Manufacturing Technology, 104, 3027-3033 (2019) [PDF]
H. So* and W. Park
Applied Surface Science, 473, 261-265 (2019) [PDF]
J. Hyeon and H. So*
Biomedical Microdevices, 21, 19 (2019) [PDF]
W. Park*, J. Sohn, G. Romano, T. Kodama, A. Sood, J.S. Katz, B.S.Y. Kim, H. So,
E.C. Ahn, M. Asheghi, A.M. Kolpak and K.E. Goodson*
Nanoscale, 10(23), 11117–11122 (2018) [PDF]
A.S. Yalamarthy, H. So*, M. M.Rojo, A.J. Suria, X. Xu, E. Pop and D.G. Senesky*
Advanced Functional Materials, 28(22), 1705823 (2018) [PDF]
[Highlighted in Feature Articles], [Selected as a Frontispiece Cover]
R.A. Miller*, H. So, H.C. Chiamori, K.M. Dowling, Y. Wang and D.G. Senesky
Applied Physics Letters, 111(24), 241902 (2017) [PDF]
M. Hou*, S.R. Jain, H. So, T.A. Heuser, X. Xu, A.J. Suria and D.G. Senesky
Journal of Applied Physics, 122(19), 195102 (2017) [PDF]
A.S. Yalamarthy†, H. So†* and D.G. Senesky,
Applied Physics Letters, 111(2), 021902 (2017) [PDF]
A.J. Suria*, A.S. Yalamarthy, T.A. Heuser, A. Bruefach, C.A. Chapin, H. So* and
D.G. Senesky,
Applied Physics Letters, 110(25), 253505 (2017) [PDF]
H. So* and D.G. Senesky
IEEE Sensors Journal, 17, 4752–4756 (2017) [PDF]
25. Dielectric properties of ligand-modified gold nanoparticle/SU-8
photopolymer based nanocomposites
A. Toor*, H. So* and A.P. Pisano
Applied Surface Science, 414, 373–379 (2017) [PDF]
K.M. Dowling, H. So*, A. Toor, C.A. Chapin and D.G. Senesky
Microelectronic Engineering, 173, 54–57 (2017) [PDF]
H. So*, J. Lim, A.J. Suria and D.G. Senesky
Applied Surface Science, 409, 91–96 (2017) [PDF]
A. Toor*, H. So* and A.P. Pisano
ACS Applied Materials & Interfaces, 9(7), 6369–6375 (2017) [PDF]
M. Hou*, H. So*, A.J. Suria, A.S. Yalamarthy and D.G. Senesky
IEEE Electron Device Letters, 38(1) 56–59 (2017) [PDF]
[Featured in Semiconductor Today News]
X. Xu*, J. Zhong, H. So, A. Norvilas, C. Sommerhalter, D.G. Senesky, M.X. Tang
AIP Advances, 6(11), 115016 (2016) [PDF]
A.J. Suria*, A.S. Yalamarthy, H. So and D.G. Senesky
Semiconductor Science and Technology, 31(11), 115017 (2016) [PDF]
R.A. Miller*, H. So, H.C. Chiamori, A.J. Suria, C.A. Chapin and D.G. Senesky
Review of Scientific Instruments, 87(9), 095003 (2016) [PDF]
J. Lim, Y. Li, D.H. Alsem, H. So, S.C. Lee, P. Bai, D.A. Cogswell, X. Liu, N. Jin, Y.-S. Yu, N.J. Salmon, D.A. Shapiro, M.Z. Bazant, T. Tyliszczak and W.C. Chueh*
Science, 353(6299), 566–571 (2016) [PDF]
[Featured in over 20 media reports including Stanford News, Lawrence Berkeley National Lab, SLAC, and U.S. Department of Energy (DOE)]
[Highlighted by Perspective in Science 353(6299), 543–544, Aug 5, 2016]
H. So* and D.G. Senesky
Applied Surface Science, 387, 280–284 (2016) [PDF]
H. So* and D.G. Senesky
Journal of Physics D: Applied Physics, 49, 285109 (2016) [PDF]
H. So*, J. Lim and D.G. Senesky
IEEE Sensors Journal, 16, 3633–3639 (2016) [PDF]
H. So*, M. Hou, S.R. Jain, J. Lim and D.G. Senesky
Applied Surface Science, 368, 104–109 (2016) [PDF]
H. So* and D.G. Senesky
Applied Physics Letters, 108(1), 012104 (2016) [PDF]
J. Lim, H.-T. Wang, J. Tang, S.C. Andrews, H. So, J. Lee, D.H. Lee, T.P. Russell
and P. Yang*
ACS Nano, 10(1), 124–132 (2016) [PDF]
K. Lee, N. Lingampalli, A.P. Pisano, N. Murthy and H. So*
ACS Applied Materials & Interfaces, 7(42), 23387–23397 (2015) [PDF]
H. So* and A.P. Pisano
International Journal of Heat and Mass Transfer, 89, 1164–1171 (2015) [PDF]
H. So* and A.P. Pisano
Langmuir, 31(23), 6588–6594 (2015) [PDF]
D.W. Paeng, D. Lee, J. Yeo, J.-H. Yoo, F.I. Allen, E. Kim, H. So, H.K. Park, A.M.
Minor and C.P. Grigoropoulos*
Journal of Physical Chemistry C, 119(11), 6363–6372 (2015) [PDF]
H. So* and A.P. Pisano
Microsystem Technologies, 21(1), 195–202 (2015) [PDF]
H. So*, K. Lee, N. Murthy and A.P. Pisano
ACS Applied Materials & Interfaces, 6(23), 20693–20699 (2014) [PDF]
H. So*, Y.H. Seo and A.P. Pisano
Biomicrofluidics, 8(4), 044119 (2014) [PDF]
H. So*, K. Lee, Y.H. Seo, N. Murthy and A.P. Pisano
ACS Applied Materials & Interfaces, 6(10), 6993–6997 (2014) [PDF]
[Highlighted as Editor’s Choice in Science 344(6188), 1130, Jun 6, 2014]
H. So, A.P. Pisano and Y.H. Seo*
Lab on a Chip, 14(13), 2240–2248 (2014) [PDF]
[Selected as a LOC HOT Article]
H. So*, J.C. Cheng and A.P. Pisano
Applied Physics Letters, 103(16), 163102 (2013) [PDF]